Comparison of Different Cure Monitoring Techniques

Abstract

The ability to measure the degree of cure of epoxy resins is an important prerequisite for making manufacturing processes for fibre-reinforced plastics controllable. Since a number of physical properties change during the curing reaction of epoxy resins, a wide variety of measurement methods exist. In this article, different methods for cure monitoring of epoxy resins are applied to a room-temperature curing epoxy resin and then directly compared. The methods investigated include a structure-borne sound acoustic, a dielectric, an optical and a strain-based observation method, which for the first time are measured simultaneously on one and the same resin sample. In addition, the degree of cure is determined using a kinetic resin model based on temperature measurement data. The comparison shows that the methods have considerable but well-explainable differences in their sensitivity, interference immunity and repeatability. Some measurement methods are only sensitive before and around the gel point, while the strain-based measurement method only reacts to the curing from the gel point onwards. These differences have to be taken into account when implementing a cure monitoring system. For this reason, a multi-sensor node is suitable for component-integrated curing monitoring, measuring several physical properties of the epoxy resin simultaneously.