Analysis of interfacial thermal stresses in a trimaterial assembly

Abstract

The interfacial stresses in, and the curvature of, an elongated trimaterial assembly, subjected to the change in temperature, are predicted based on an approximate structural analysis (strength-of-materials) model. The obtained results can be helpful in stress-strain evaluations and physical design of trimaterial assemblies in microelectronic and photonic packaging. © 2001 American Institute of Physics.