PCB-based current sensor design for sensing switch current of a nonmodular GaN power semiconductor

Abstract

GaN-based power semiconductors exhibit small on-resistance and high dv/dt of the switch characteristics, thereby enabling the construction of high-efficiency, high-density semiconductor systems with fast switching and low power loss characteristics and miniaturization of passive devices. However, owing to the characteristics of GaN devices that result in them being significantly faster than other devices, the accuracy of the switching transient response significantly affects the noise or inductance in the device. Therefore, securing sufficient sensor bandwidth is considerably important for accurate current measurement in GaN-based devices. Conversely, the current sensor in the form of a non-insulated coil must secure sufficient bandwidth and overcome the tradeoff relationship with measurement sensitivity; moreover, the sensor configuration must be applicable to various power semiconductor types. This study proposes a current sensor model that applies the principle of the printed circuit board Rogowski coil to a surface mount device-type GaN-based half-bridge structure. This structure is applicable to a nonmodular power converter and is designed to secure sufficient bandwidth with a minimum area while simultaneously exhibiting high sensitivity. For the coil design, mutual inductances with existing coil structures were compared and analyzed, and the frequency response and magnetic analysis were evaluated. Experimental verification was performed and the transient response characteristics in various DC voltage ranges are discussed.