5 GHz Si-CMOS differential power amplifier module with directly connected dipole antenna

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Abstract

A 5 GHz differential power amplifier (PA) module with a dipole antenna has been implemented. The PA integrated circuit (IC) was mounted on a fiuoroplastic substrate on which the dipole antenna was fabricated. The differential PA IC was fabricated using 0.18 μm Si-CMOS process. For the differential operation, an n/nMOS push-pull circuit was employed. The PA IC was directly connected to the balance input of dipole antenna without a balun using stud bump bonding on a fiuoroplastic substrate. The antenna was designed using a 3-dimensional electromagnetic simulator including a feed line. The measured gain of the PA module was 12.6dB at 5 GHz. © IEICE 2008.

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APA

Shimoyama, K., Yoshida, S., Thanh, T. T., Matsuzaki, K., Oguma, H., Kameda, S., … Tsubouchi, K. (2008). 5 GHz Si-CMOS differential power amplifier module with directly connected dipole antenna. IEICE Electronics Express, 5(7), 229–234. https://doi.org/10.1587/elex.5.229

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