Variation of the Strength of a Grain in Polycrystalline Copper Thin Films of Semiconductor device Based on the Order of Atom Arrangement

LUO, Y., Sakamoto, H., SUZUKI, K., & MIURA, H. (2018). Variation of the Strength of a Grain in Polycrystalline Copper Thin Films of Semiconductor device Based on the Order of Atom Arrangement. The Proceedings of the Materials and Mechanics Conference, 2018(0), PS22. https://doi.org/10.1299/jsmemm.2018.ps22