Numerical study of material properties, residual stress and crack development in sintered silver nano-layers on silicon substrate

Abstract

In order to improve the performance of thin film devices, it is necessary to characterize their mechanical, as well as electrical, properties. In this work, a model is developed for analysis of the mechanical and electrical properties and the prediction of residual stresses in thin films of silver nanoparticles deposited on silicon substrates. The model is based on inter-particle diffusion modeling and finite element analysis. Through simulation of the sintering process, it is shown how the geometry, density, and electrical resistance of the thin film layers are changed by sintering conditions. The model is also used to approximate the values of Young's modulus and the generated residual stresses in the thin film in the absence and presence of cracks in the film. The results are validated through comparing them with available experimental data.