The influence of carbon nanotubes on the properties of Sn solder

Abstract

The microstructure and properties of Sn lead-free solders with various carbon nanotubes (CNTs) contents (0, 0.025, 0.05, 0.075, 0.1, 0.125, wt. %) were studied. The results indicate that the wettability and the mechanical properties of solder joints both were effectively improved when the content of CNTs was 0.075 wt. %. Furthermore, adding 0.075 wt. % CNTs can effectively refine the structure of solder and inhibit the formation of brittle intermetallic compounds (IMCs). The solder joints fracture mode of the specimen was mainly ductile fracture when the addition of CNTs was 0.075wt.%.