Electroforming process in metal-oxide-polymer resistive switching memories

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Abstract

Electroforming of an Al/Al2O3/polymer/Al resistive switching diode is reported. Electroforming is a dielectric soft-breakdown mechanism leading to hysteretic current-voltage characteristics and non-volatile memory behavior. Electron trapping occurs at early stages of electroforming. Trapping is physically located at the oxide/polymer interface. The detrapping kinetics is faster under reverse bias and for thicker oxides layers. Thermally detrapping experiments give a trap depth of 0.65 eV and a density of 5x10 17 /cm2. It is proposed that the trapped electrons induce a dipole layer across the oxide. The associated electric field triggers breakdown and ultimately dictate the overall memory characteristics. © 2012 IFIP International Federation for Information Processing.

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Chen, Q., Gomes, H. L., Kiazadeh, A., Rocha, P. R. F., De Leeuw, D. M., & Meskers, S. C. J. (2012). Electroforming process in metal-oxide-polymer resistive switching memories. In IFIP Advances in Information and Communication Technology (Vol. 372 AICT, pp. 527–534). Springer New York LLC. https://doi.org/10.1007/978-3-642-28255-3_58

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