High-performance circuit boards based on mesoporous silica filled PTFE composite materials

Abstract

A series of composite materials based on a hydrophobic mesoporous silica (MCM-41-m) filled polytetrafloroethylene (PTFE) were synthesized. The composite boards prepared from the composite materials were thermally stable (T 5% > 500°C). The dielectric constant (Dk) and z-axis coefficient of thermal expansion (CTEz) were significantly decreased with increasing MCM-41-m content due to the presence of the well-dispersed hydrophobia and ordered mesoporous structure MCM-41-m particles. Ultra low Dk (1.70) and CTE2 (11.8 ppm/°C) were obtained for the composite board containing 40 wt % of MCM-41-m. The result indicated that the as-prepared composite materials are potentially useful as radio-frequency/microwave substrate materials. © 2004 The Electrochemical Society.