Direct Silicon Heterostructures with Methylammonium Lead Iodide Perovskite for Photovoltaic Applications

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Abstract

We investigated the formation of photovoltaic (PV) devices using direct n-Si/MAPI (methylammonium lead tri-iodide) two-sided heterojunctions for the first time (as a possible alternative to two-terminal tandem devices) in which charge might be generated and collected from both the Si and MAPI. Test structures were used to establish that the n-Si/MAPI junction was photoactive and that spiro-OMeTAD acted as a 'pinhole blocking' layer in n-Si/MAPI devices. Two-terminal 'substrate' geometry devices comprising Al/n-Si/MAPI/spiro-OMeTAD/Au were fabricated and the effects of changing the thickness of the semitransparent gold electrode and the silicon resistivity were investigated. External quantum efficiency and capacitance-voltage measurements determined that the junction was one-sided in the silicon - and that the majority of the photocurrent was generated in the silicon, with there being a sharp cutoff in photoresponse above the MAPI bandgap. Construction of band diagrams indicated the presence of an upward valence band spike of up to 0.5 eV at the n-Si/MAPI interface that could impede carrier flow. Evidence for hole accumulation at this feature was seen in both Kelvin-probe transients and from unusual features in both current-voltage and capacitance-voltage measurements. The devices achieved a hysteresis-free best power conversion efficiency of 2.08%, VOC 0.46 V, JSC 11.77 mA/cm2, and FF 38.4%, demonstrating for the first time that it is possible to create a heterojunction PV device directly between the MAPI and n-Si. Further prospects for two-sided n-Si/MAPI heterojunctions are also discussed.

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APA

Mariotti, S., Turkestani, M. A., Hutter, O. S., Papageorgiou, G., Major, J. D., Swallow, J., … Durose, K. (2020). Direct Silicon Heterostructures with Methylammonium Lead Iodide Perovskite for Photovoltaic Applications. IEEE Journal of Photovoltaics, 10(4), 945–951. https://doi.org/10.1109/JPHOTOV.2020.2981805

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