Memory-Logic Hybrid Gate with 3D-Stackable Complementary Latches for FinFET-based Neural Networks

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Abstract

A memory-logic hybrid gate with complementary resistive switching pairs on vias in BEOL FinFET technologies with an area-efficient, 3D-stackable structures is proposed. Stable output logic stages enabled by the complementary states on the RRAM pair have been demonstrated. Through stacked-vias architectures, logic operations based on multiple non-volatile states are achieved.

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Lee, C., Chih, Y. D., Chang, J., Lin, C. J., & King, Y. C. (2019). Memory-Logic Hybrid Gate with 3D-Stackable Complementary Latches for FinFET-based Neural Networks. In Technical Digest - International Electron Devices Meeting, IEDM (Vol. 2019-December). Institute of Electrical and Electronics Engineers Inc. https://doi.org/10.1109/IEDM19573.2019.8993511

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