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Device technologies for integrated packaged transceivers

Optical Fiber Communication Conference, OFC 2015 (2015)
DOI: 10.1364/ofc.2015.w1h.2
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Abstract

InP-based PICs have enabled a first generation of CFP2-ACO modules for line-side 100Gb/s deployment. A number of options are available to scale to higher volumes and enable high density transport up to 400Gb/s.

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APA

Griffin, R. A. (2015). Device technologies for integrated packaged transceivers. In Optical Fiber Communication Conference, OFC 2015. OSA - The Optical Society. https://doi.org/10.1364/ofc.2015.w1h.2

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