Abstract
We used depth-resolved microcathodoluminescence spectroscopy (DRCLS) and Kelvin probe force microscopy (KPFM) to measure and map the temperature distribution and defect generation inside state-of-the-art AlGaN/GaN-based high electron mobility transistors (HEMTs) on a scale of tens of nanometers during device operation. DRCLS measurements of near band edge energies across the HEMT's source-gate-drain regions reveal monotonic temperature increases across the submicron gate-drain channel, peaking under the drain side of the gate. DRCLS defect emissions mapped laterally and localized depthwise near the two-dimensional electron gas interface increase with device operation under the drain-side gate and correlate with higher KPFM surface potential maps. © 2009 American Institute of Physics.
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CITATION STYLE
Lin, C. H., Merz, T. A., Doutt, D. R., Hetzer, M. J., Joh, J., Del Alamo, J. A., … Brillson, L. J. (2009). Nanoscale mapping of temperature and defect evolution inside operating AlGaN/GaN high electron mobility transistors. Applied Physics Letters, 95(3). https://doi.org/10.1063/1.3189102
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