High‐Temperature Reaction Between Cemented Tungsten Carbide and Copper

Abstract

Interdiffusion in the system cemented tungsten carbide‐molten copper has been studied in the range ≤1120°C with special emphasis on the effects of WC grain size and Co content. Techniques used for analyzing the diffusion layers obtained are EPMA, optical microscopy, and microhardness measurement. A Cu‐bonded WC layer develops with simultaneous diffusion of Co from the cemented carbide into the bulk copper. The Cu‐bonded WC layer grows until a Co‐rich layer forms at the Cu/WC‐Co interface; further heating pushes the Cu‐bonded WC layer deep into the bulk cemented carbide without any significant change in layer thickness. When the WC grain size is reduced and the cobalt content increased, the penetration of copper into cemented carbides increases. A tentative mechanism of interdiffusion has been proposed based on the experimental results. Copyright © 1977, Wiley Blackwell. All rights reserved