TiN coatings on mild steel substrates with electroless nickel as an interlayer

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Abstract

Electroless nickel deposits are incorporated as an interlayer between TiN coatings and mild steel substrates. The electroless nickel layer recrystallizes during r.f. sputtering and a coating assembly of TiN/Ni3/Fe is formed. The employment of electroless nickel results in an increase in the surface hardness as well as the adhesion strength. A Knoop surface hardness as high as 2120 HK5 (close to the hardness of bulk TiN) can be achieved in the interlayer-modified TiN coating. © 1991.

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Chen, Y. I., & Duh, J. G. (1991). TiN coatings on mild steel substrates with electroless nickel as an interlayer. Surface and Coatings Technology, 48(2), 163–168. https://doi.org/10.1016/0257-8972(91)90140-R

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