Abrasion-resistant bioelectronics based on a three-dimensional topological architecture and covalent chemical anchoring

Abstract

Integrating electronics with biological systems could be of use in the monitoring of human health and the treatment of diseases. However, dynamic body movements exert stress and induce micromotions at the interface between a substrate and functional layers. This often leads to device disintegration and failure, and hampers long-term utility and reliability. Here we report abrasion-resistant bioelectronics based on a three-dimensional topological interpenetrating architecture that is reinforced with covalent chemical anchoring. The approach, which we term TopoLock, is applicable to a range of bioelectronic materials and fabrication technologies. In multiple preclinical animal models, we show that this system can be used for long-term electrophysiological recording, electrical stimulation and electrochemical sensing at challenging anatomical locations that experience continuous mechanical stresses.