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Analysis of Defect Rate Improvement in The Smartphone Assembly Industry Using SPC and DMAIC Approach

  • Rahmawati N
  • Hasbullah H
Journal of International Conference Proceedings (2023) 6(1) 14-25
DOI: 10.32535/jicp.v6i1.2233
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Abstract

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Rahmawati, N., & Hasbullah, H. (2023). Analysis of Defect Rate Improvement in The Smartphone Assembly Industry Using SPC and DMAIC Approach. Journal of International Conference Proceedings, 6(1), 14–25. https://doi.org/10.32535/jicp.v6i1.2233

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