Currency note paper and banana fiber pulp waste utilization and its effect of density, moisture and temperature on wood products

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Abstract

Possibilities for use of banana fiber and currency notes thermally modified groups were evaluated for the production of plywood boards in industrial conditions. Formats of groups were treated at temperatures of 190 °C, 200 °C, 210 °C, and 215 °C for each 9 h to making the pulp process. By combining the treated and non-treated formats of veneer in types of board groups, thirteen different types of board were made. Analysis showed that the examined physical and mechanical properties were influenced by both the type of construction and the applied thermal treatment. Boards composed only of thermally modified group achieved the best results regarding moisture absorption and dimensional stability, and boards composed of the combined currency notes and banana fiber had better mechanical properties. As per the analysis of plywood board when used banana fiber used in pulp of plywood board is suitable at190 °C temperature rather than 215 °C temperature with comparing the other types of board. 25 °C temperature is less requires for control group board. We can consume cost of heat which is used in this process and getting the hard quality of plywood. At 215 °C temperature of processing cost of heat is 10% of plywood cost and when at 190°C of processing the cost of heat is 9.06% of plywood cost so that we can consume 0.94% cost of heat. Moisture content of temperature conditioned boards of control group is 9.01% density of conditioned boards 436.36 kg/m3. Highest bending strength and modulus of elasticity of boards is 48.07MPa and 6078 MPa in longitudinal direction and bending strength and modulus of elasticity of boards in cross-section 28.40MPa and 2027 MPa.

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Matani, A. G., Bhatkar, P. P., & Doifode, S. K. (2019). Currency note paper and banana fiber pulp waste utilization and its effect of density, moisture and temperature on wood products. International Journal of Recent Technology and Engineering, 8(3), 6484–6487. https://doi.org/10.35940/ijrte.C4643.098319

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