Effect of pH of sulfate solution on electrochemical behavior of Pb-free solder candidates of SnZn and SnZnCu systems

Abstract

The corrosion resistance of the next generation solders is one of the key factors responsible for reliability of solder joints. The paper focuses on the comparative studies of corrosion behavior of Pb-free solder candidates of binary Sn-Zn and ternary Sn-Zn-Cu systems. The accelerated corrosion tests were made by means of voltammetric measurements carried out in the sulfate solution. The effect of its pH on the electrochemical behavior of selected alloys was identified. © The Author(s).