Effects of Fluoride and Iodide Addition to ZnCl2 Flux on Spreadability of Sn-Pb Solder on Cu Plate

Abstract

The objective of this study is to clarify the effect of the chemical displacement reaction between Sn-Pb solder and ZnCl2 binary system fluxes containing fluorides or iodides as a second component on the spreadability of Sn-Pb solder. The results obtained are summarized as follows. (1)When ZnCl2 binary system fluxes containing fluorides such as AgF, BiF3 and NiF2 • 4H20 or iodides such as Agl, BiI3 and Nil2 • 6H20 were used, a remarkable chemical displacement reaction between Sn-Pb solder and the fluxes took place and the spread area of the solder with these fluxes was larger than that with pure ZnCl2 flux. (2)When ZnCl2 binary system fluxes containing fluorides such as ZnF2, MnF2, KF, NaF, LiF and BaF2 or iodides such as ZnF2 and CdF2 were used, the chemical displacement reaction hardly took place and the spread area was almost the same as that with pure ZnCl2. © 1979, The Society of Materials Science, Japan. All rights reserved.