Abstract
Sn-0.7Ag-0.5Cu lead-free solder is an alternative solder material suitable to replace Sn-Pb solder in electronic manufacturing. In this review, the change in the microstructure, elements, the structural and melting point of Sn-0.7Ag-0.5Cu after the addition of different compositions of bismuth were discovered. Besides, the influence of bismuth in lead-free solder alloys attracts to be studied due to its capability to improve the wettability and solder spread.
Cite
CITATION STYLE
Muhamad, M., Masri, M. N., Nazeri, M. F. M., & Mohamad, A. A. (2020). The Effect of Bismuth Addition on Sn-Ag-Cu Lead-Free Solder Properties: A Short Review. In IOP Conference Series: Earth and Environmental Science (Vol. 596). IOP Publishing Ltd. https://doi.org/10.1088/1755-1315/596/1/012007
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