Predicting the reliability of zero-level TSVs

0Citations
Citations of this article
6Readers
Mendeley users who have this article in their library.

Abstract

The ability to predict TSV reliability still in its infancy and is hampered by little published test data (primarily simulation). Any prediction must take into account changes in interfacial material. DfR recommends an approach of: don't simulate/test nominal; investigate realistic worst-case. However, there is no need to reinvent the wheel. A significant amount of relevant material, especially in regards to interfacial reliability can be found in studies on fiber-reinforced ceramic composites.

Cite

CITATION STYLE

APA

Caswell, G., & Hillman, C. (2012). Predicting the reliability of zero-level TSVs. In Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012 (pp. 1–8). IMAPS-International Microelectronics and Packaging Society. https://doi.org/10.4071/2012dpc-wa13

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free