Self-Healing and Reprocessable Oleic Acid-Based Elastomer with Dynamic S-S Bonds as Solvent-Free Reusable Adhesive on Copper Surface

Abstract

In the last decade, the application of dynamic covalent chemistry in the field of polymeric materials has become the subject of an increasing number of studies, gaining applicative relevance. This is due to the fact that polymers containing dynamic functions possess a structure that affords reprocessability, recyclability and peculiar self-healing properties inconceivable for “classic” polymer networks. Consequently, the synthesis of a dynamic covalent chemistry-based polymer and its chemical, thermal, and mechanical characterizations are reported in the present research. In particular, oleic acid has been used as starting material to follow the founding principles of the circular economy system and, thanks to the aromatic disulfide component, which is the foundation of the material dynamic characteristics, the obtained polymer resulted as being reprocessable and self-healable. Moreover, the polymer can strongly interact with copper surfaces through the formation of stable Cu-S bonds. Then, the application of the polymer as a solvent-free reusable adhesive for copper was investigated by lap joint shear tests and comparisons with the properties of an analogous material, devoid of the disulfide bonds, were conducted.