Wettability and thermal properties of Sn-0.7Cu- 0.05Ni-xZn solder alloy

Abstract

This study investigate the effect of Zn additions on wettability and thermal properties of Sn-0.7Cu-0.05Ni lead-free solder alloy. The additional of alloying element have been developed by using casting technique with different percentage of Zn which is 0.5, 1.0 and 1.5 wt.%. The Sn-0.7Cu-0.05Ni-xZn solder alloy samples were then analyzed by using the optical microscope (OM) to observerse the wettability perfomance by contact angle. From this study, it was found that different composition of Zn affected the wettability and thermal properties of Sn- 0.7Cu-0.05Ni solder alloys. The addition of 0.5 wt.% has slightly increase the melting point while the addition of higher than 1.0 wt.% Zn can decrease the melting temperature. The addition of 0.5 wt.% of Zn also can reduce the undercooling of solder alloy. Thus, the minor addition of Zn for Sn-0.7Cu-0.05Ni can influence the wettability and thermal properties of solder alloy.