HVDC converter cooling system with a phase change dispersion

Abstract

High voltage direct current converters require efficient cooling of thyristors via heat sinks. Currently, infrastructures use deionised water as a means of cooling the high voltage direct current converters; however, recent research has shown that other fluids have potential to offer more efficient cooling. Phase change dispersions are a new class of heat transfer fluids that employ the latent heat of phase change, thus offering isothermal cooling during melting. For cooling applications, the temperature increase during operation is thus lowered when using phase change dispersions (compared to water) and consequently, the heat sink and thyristors surface temperatures are reduced. In this investigation, a phase change dispersion with non-conductive components, high stability, high capacity and low viscosity has been developed and tested. An experimental setup of a real size heat sink has been installed and the heat transfer behaviour of both the formulated phase change dispersion and water have been investigated and a comparison has been presented. Using water as the heat transfer fluid, the temperature increase from inlet to outlet of the heat sink was 4 K and with the formulated phase change dispersion (at the same mass flow rate and heat input) the temperature increase was 2 K. The phase change dispersion caused a 50% reduction in the heat sink surface temperature. Furthermore, the global heat transfer coefficients obtained for the phase change dispersion were found to be independent of the heating input applied, unlike the trend found for water, additionally, the global heat transfer coefficients were found to be similar to those obtained for water at the same mass flow rates and reached a maximum value of 6100W m2 K-1. Despite this, the pressure drops and viscosities obtained for the phase change dispersion were higher than for water. Overall, the current investigation demonstrates the ability of using a phase change dispersion as a cooling fluid for the cooling of electronic components, which thus far is limited to using air and water cooling and cannot reach the cooling capacity achieved by phase change dispersions.