Numerical analysis of interfacial deformation and temperature rise during ultrasonic Al ribbon bonding

Abstract

The plastic deformation, thermal behaviour and interfacial state during ultrasonic bonding of Al ribbon with substrate were analyzed based on numerical simulations. The numerical simulations were carried out by finite difference and element methods. The change of bond interface temperature with the bonding time t was simulated. It is suggested that the interfacial frictional behaviour between ribbon and substrate does not only affect the temperature rising behaviour but also the stress situation and plastic deformation behaviour, i.e., the ribbon deformation and the frictional slip behaviours influence each other. It is also found that partial constraint (frictional slip) at the bond-interface increases interfacial shear stress drastically and controls the frictional heat input and temperature rise of the Al ribbon. © Published under licence by IOP Publishing Ltd.