High-strength and high-speed bonding technology using thick Al-Ni wire

Abstract

In order to create high-strength and high-speed thick Al wire bonding technology, high-temperature bonding at 423 K using Al-Ni wire has been investigated. It was found that Al-Ni wire bonds exhibit higher bonding strength than those of Al wire bonds. Al-Ni wire bonds joined at 423 K for 40 ms exhibited high-strength comparable to those of Al-Ni wire bonds joined at RT for 180ms. It was found that high-temperature, high-speed bonding substantially reduces the occurrence of Si damage. High-temperature and high-speed bonding with Al-Ni wire can be considered as a promising bonding technology for the mass production of low cost power modules.