Thin Co films (1-8 nm) were directly, sequentially, and co-deposited with Si (3.6-29.2 nm) on the (√3 × √3)-R30° reconstruction of 6H-SiC(0001). The films were annealed over a temperature range of 823-1373K and investigated with XAFS, XPS, AES and AFM. After annealing up to 1373K directly deposited Co films do not transform entirely to cobalt disilicide and C segregation is observed on the surface of the films. On the other hand, sequentially and co-deposited films do form cobalt disilicide after annealing at 823K, but also show islanding after annealing at 923K.
CITATION STYLE
Platow, W., Wood, D. E., Burnette, J. E., Nemanich, R. J., & Sayers, D. E. (2001). XAFS studies of the formation of cobalt silicide on (√3 × √3) SiC(0001). Journal of Synchrotron Radiation, 8(2), 475–477. https://doi.org/10.1107/S0909049500017921
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