Investigation of defect copper substructure disrupted in creep condition under the action of magnetic field

Abstract

The defect substructure of M00b copper samples loaded up to disruption in creep condition both under and without the action of 0.35 T magnetic field is investigated in the paper. Material near the disrupted surface and at certain distances from it received the serious study. It has been ascertained that when copper disrupting without magnetic action on creep process the main type of dislocation substructure is the cellular one irrespectively of the distance to disruption surface. As the result of magnetic field influence on creep process the main type of dislocation substructure is replaced by the stripe-like one. The distinctive quantitative characteristics of dislocation substructures are observed. Moreover, a gradient behavior of the number of stress raisers has been revealed when moving away from disruption surface both in deformation conditions with and without a magnetic field.