Abstract
Forced convection cooling of fins on a high-temperature wall has been used to cool high-power electronic devices. We numerically calculated and experimentally measured the forced convection heat transfer coefficient and pressure drop of a diamond-shaped fin-array with water flow in this study, which had been reported to have a self-induced flip-flop flow phenomenon. Although the flip-flop flow phenomenon occurred in calculations, it was not observed in experiments. The heat transfer and pressure drop of the diamond-shaped fin-array could be estimated with equations for turbulent flow in tubes.
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CITATION STYLE
Hirasawa, S., Fujiwara, A., Kawanami, T., & Shirai, K. (2014). Forced Convection Heat Transfer Coefficient and Pressure Drop of Diamond-Shaped Fin-Array. Journal of Electronics Cooling and Thermal Control, 04(03), 78–85. https://doi.org/10.4236/jectc.2014.43009
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