Continued Scaling in Semiconductor Manufacturing Enabled by Advances in Lithography

Abstract

Our efforts to uphold Moore's Law include continued enhancements of system performance and the development of high-numerical-aperture (0.55 NA) EUVL systems. They also include constant innovations in well-established deep-UV lithography systems that have been driving down cost of ownership and have supported the manufacturing of new device architectures e.g. 3D memories. Full potential of lithography - its ultimate capability when used in manufacturing - is realized by making exposure systems, metrology tools, and computational algorithms work together synergistically. It is our belief that continued advances in this holistic lithography will enable cost-effective scaling in semiconductor device manufacturing beyond the next decade.