The influences of silver content in lead-free solder Sn-0,7CuxAg (SAC) in physical and mechanical properties

Abstract

As an increment of soldering technology that SnPb has been banned since 2006 as Pb a toxic chemical content. The usage of Copper and silver has been found that can be alloyed to Sn as Sn-Cu-Ag (SAC). The characteristic of a new alloy such as Sn-Cu-Ag has to be achieved as Physical and Mechanical Properties SnPb. In this research is carried out of vary percentage of Copper and Silver has been adding to Sn-Cu-Ag. The method of this research was used Mass Balanced of 1,1.5 and 2 % of Silver is heated at 600 o C as solder alloy SnCuAg. The results have shown that shear strength is increasing in the increasing percentage of Silver on SnCuAg alloy Lead-Free Solder. The lowest of Melting temperature is 182 oC of 1% Silver content on Sn-0,7Cu x Zn.