Selective Metallization of 3D Printable Thermoplastic Polyurethanes

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Abstract

This paper presents a selective metallization method for the newly developed 3D printable thermoplastic polyurethane elastomers (TPU): FilaFlex ®, SemiFlex™, PolyFlex™, and NinjaFlex®. Silver nanoparticles were fabricated in-situ by photo-reduction on the surface of TPUs and acted as catalysts for copper ion adsorption. This method demonstrates the successful fabrication of copper patterns on flexible TPU filaments. Furthermore, Polyflex™ and acrylonitrile butadiene styrene (ABS) filaments printed in the same part have been used to enable selective electroless plating directly on PolyflexTMmaterial. Electroless copper deposited onto PolyflexTMhas a sheet resistance of (139.4 ± 7.2) m Ω /□ and a copper conductivity of (1.1 ± 0.1) × 107 S/m that is comparable with bulk copper. Copper-plated PolyflexTMinterconnects were fabricated as a proof of concept demonstrators.

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Ryspayeva, A., Jones, T. D. A., Khan, S. R., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., … Marques-Hueso, J. (2019). Selective Metallization of 3D Printable Thermoplastic Polyurethanes. IEEE Access, 7, 104947–104955. https://doi.org/10.1109/ACCESS.2019.2931594

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