A high-performance body-tied FinFET Bandgap Engineered SONOS (BE-SONOS) for NAND-type flash memory

Abstract

A body-tied FinFET bandgap engineered (BE)-silicon-oxide-nitride-oxide-silicon (SONOS) NAND Flash device is successfully demonstrated for the first time. BE-SONOS device [1] with a BE oxide-nitride-oxide barrier is integrated in the FinFET structure with a 30-nm fin width. FinFET BE-SONOS can overcome the unsolvable tradeoff between retention and erase speed of the conventional SONOS. Compared with the current floating-gate Flash devices, FinFET BE-SONOS provides both retention and erase-speed performance, while eliminating the scaling limitations and is, thus, an important candidate for further scaling of nand flash. © 2007 IEEE.