Viscoplastic parameter identification for lead-free solder alloy by micro-indentation, FE simulation and optimization

Abstract

A system for material parameter identification by depth-sensing micro-indentation, Finite Element (FE) simulation and optimization has been developed. In this system, the material parameter identification is treated as an optimization problem by minimizing the difference between experimentally obtained indentation load vs. penetration (P-h) curves and the corresponding FE simulation results. To reduce the computation time, a multipoint approximation response surface methodology (MARS) is used in combination with the interaction of high- and low-fidelity analysis algorithms. Using this system, the viscoplastic properties of a lead-free solder (Sn-3.5Ag-0.75Cu) were identified. This identification method has been confirmed by comparing the obtained material parameters with those determined from uniaxial compression tests. © 2008 The Japan Society for Technology of Plasticity.