Application of Six Sigma in Semiconductor Manufacturing: A Case Study in Yield Improvement

Abstract

The purpose of this chapter is to outline systematic implementation of the Six Sigma DMAIC methodology as a case study in solving the problem of poor wafer yields in semiconductor manufacturing. The chapter also describes well-known industry standard business processes to be implemented and benchmarked in a semiconductor wafer fabri- cation facility to manage defect and yield issues while executing a Six Sigma project. The execution of Six Sigma enabled identification of the key process factors, root cause analy- sis, desired performance levels, and Cpk improvement opportunities. Implementing multilevel factorial design of experiments (DOE) study revealed critical input param- eters on process tools contributing to defect formation. Improvement performed on these process tools resulted in in-line defect reduction and ultimately improving final yields.