Effect of epoxy molding compound material and leadframe roughness to integrated circuit package for automotive devices

Abstract

This research studied the effect of epoxy molding compound material and leadframe roughness of an integrated circuit package for automotive devices. In the manufacturing process, the epoxy molding compound material and leadframe roughness are the main factors that effect the coefficient of thermal expansion (CTE) and reliability for an automotive device package with no delamination in high temperature applications. In the experiment, two types of epoxy molding compound materials were studied and compared between standard and roughened leadframe for a quad flat non lead (QFN) package. For the reliability test, the epoxy molding compound materials type A and type B with different leadframe were analyzed with moisture sensitivity level 1 to observe delamination inside the packages. The results showed that the CTE mismatch of epoxy molding compound material type A is less than the CTE mismatch of epoxy molding compound material type B with both standard and roughened leadframe. Moreover, the results also found no delamination for epoxy molding compound material type A with roughened leadframe. In addition, both epoxy molding compound materials showed significant delamination inside packages with standard leadframe.