QC-fill: Quick-and-cool X-filling for multicasting-based scan test

34Citations
Citations of this article
3Readers
Mendeley users who have this article in their library.
Get full text

Abstract

This paper presents an X-fill scheme that properly utilizes the don't-care bits in test patterns to simultaneously reduce the test time as well as the test power (including both capture power and shifting power). This scheme, called Quick-and-Cool X-fill (QC-Fill), built upon the multicasting-based scan architecture, further leverages on the merits of previous low-capture-power X-fill methods through techniques like multicasting-driven X-fill and clique stripping. QC-Fill is independent of the automatic test pattern generation patterns and does not require any extra area overhead. Experimental results demonstrate that this scheme strikes a good balance between the seemingly conflicting criteria of low power and test compression. © 2009 IEEE.

Cite

CITATION STYLE

APA

Tzeng, C. W., & Huang, S. Y. (2009). QC-fill: Quick-and-cool X-filling for multicasting-based scan test. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 28(11), 1756–1766. https://doi.org/10.1109/TCAD.2009.2030353

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free