Influence of Oxygen Flow Rate on Sputter Deposition Rate and SEM Image of Copper Oxide Thin Films

Abstract

Recently, copper oxide thin film has been studied because of its low cost, sensitivity to ambient condition and easiness to produce oxide thin film. It is one of the p-type semiconductor oxides materials that are suitable to be used as gas sensing material. In order to improve the sensitivity and to optimize the properties of copper oxide thin film, it is essential to study the physical structure of copper oxide. In current studies, copper oxide thin film has been deposited by RF magnetron sputtering at different substrate bias voltages and oxygen flow rates. The results reveal that the deposition rate decreased when the oxygen flow rate above 4 sccm. SEM image reveal that nanostructure copper oxide was also obtained when the oxygen flow rate was above 4 sccm. On the other hand, no significant effect on the substrate bias voltage toward the sputter deposition rate was observed.