A crack initiation and propagation simulation and the fatigue characteristics of solder joints considering the material property changes

Abstract

The re-working of the manufacturing process from the reliability evaluation after the production process is a significant cost and loss of energy. In-vehicle electronic devices are exposed to multiple environmental loads such as thermal and vibrational loads. The effects of the material property changes in the thermal cycle load on the fatigue life of solder joints were estimated with our fatigue simulation for the purpose of constructing a design method considering the fatigue characteristic changes in the thermal cycle. The fatigue lives were estimated with and without considering the creep property changes measured by indentation tests. The fatigue ductility index and the coefficients increased toward the reported values by considering the creep property changes. © Published under licence by IOP Publishing Ltd.