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Stress distribution variations during nanoindentation failure of hard coatings on silicon substrates

Nanotechnology and Precision Engineering (2023) 6(4)
DOI: 10.1063/10.0022175
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Abstract

ARTICLE HIGHLIGHTS HIGHLIGHTS • Fracture morphologies caused by nanoindentation on hard Si coatings are studied. • Interfacial energies, fracture toughness, and stress distributions are analyzed. • Indenter tip sharpness is found to influence electrical conduction.

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Dash, R., Bhattacharyya, K., & Bhattacharyya, A. S. (2023). Stress distribution variations during nanoindentation failure of hard coatings on silicon substrates. Nanotechnology and Precision Engineering, 6(4). https://doi.org/10.1063/10.0022175

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