Mechanical lapping, handling and transfer of ultra-thin wafers

Abstract

This paper presents a new technique for thinning down up to 10 μm and handling various semiconductor devices, and transferring them onto host substrates. An optimized mechanical lapping is used to remove the wafer backside after the fabrication process by way of a cavity-wafer. The original transfer technique based on the different thermal properties of waxes or epoxy layers is described, and the electrical results obtained on test devices are presented.