Journal Article

Practical Use Situation of Sn-Bi Solder System and Problem in the Future

Journal of Japan Institute of Electronics Packaging (2003) 6(5) 394-399
DOI: 10.5104/jiep.6.394
2Citations
Citations of this article
2Readers
Mendeley users who have this article in their library.
Get full text

Cite

CITATION STYLE

APA

Serizawa, K., Shimokawa, H., & Terasaki, T. (2003). Practical Use Situation of Sn-Bi Solder System and Problem in the Future. Journal of Japan Institute of Electronics Packaging, 6(5), 394–399. https://doi.org/10.5104/jiep.6.394

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free