Influence of Metal and Polymer Substrate on SiC x N y O z Film Formation by Non-Heat Assistance Plasma-Enhanced Chemical Vapor Deposition Using Monomethylsilane, Nitrogen and Argon Gases

Abstract

© The Author(s) 2019. Using the plasma-enhanced chemical vapordeposition without any heating assistance, a SiCxNyOz film was formed on a substrate made of metals and polymers, such as aluminum, tin, polyethylene naphthalate, polyvinylchloride and polytetrafluoroethylene. These have low melting points and low glass transition temperatures. Utilizing non-corrosive gases, such as monomethylsilane, nitrogen and argon, at 10–20 Pa, 80–500 nm-thick films were obtained. The film thickness and film composition of the silicon, carbon, nitrogen and oxygen were found to depend on the substrate material. When the substrate contained oxygen, chlorine and fluorine atoms, the film became thin and contained a high oxygen concentration.