Crystallization behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) alloy ribbons

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Abstract

Amorphous Ti-(50-x)Ni-xCu (at%) (x = 20, 25, 27, 30) alloy ribbons were prepared by melt spinning. Subsequently, the crystallization behavior of the alloy ribbons was investigated by X-ray diffraction and differential scanning calorimetry. ΔT (the temperature gap between Tg and Tx) increased from 33 K to 47 K and the wavenumber (Qp) decreased from 29.44 nm-1 to 29.29 nm-1 with increasing Cu content from 20 at% to 30 at%. The activation energy for crystallization decreased from 188.5 kJ/mol to 170.6 kJ/mol with increasing Cu content from 20 at% to 25 at%; afterwards, the activation energy remained near constant. Crystallization occurred in two-stage: amorphous-B2-TiCu2 in Ti-Ni-Cu alloys with Cu content less than 25 at%, while it occurred in three-stage; amorphous-B2-TiCu-TiCu2 in Ti-Ni-Cu alloys with Cu content more than 27 at%. © 2011 KIEEME. All rights reserved.

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Kim, M. S., Jeon, Y. M., Im, Y. M., Lee, Y. H., & Nam, T. H. (2011). Crystallization behavior of Ti-(50-x)Ni-xCu(at%) (x = 20-30) alloy ribbons. Transactions on Electrical and Electronic Materials, 12(1), 20–23. https://doi.org/10.4313/TEEM.2011.12.1.20

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