EMI shielding performance for varies frequency by metal plating on mold compound

Abstract

Conformal metalization on mold compound offers new possibility for IC package design to improve features such as rigidization of the flexible core, heat sink capability, 3D-circuit patterning and the electromagnetic interference (EMI) shielding. With the unique processes, the fabrication technology had enabled to achieve the high reliable performance and had passed the electrical test. Following research after the reliability concern, this paper further study the shielding effectiveness of varying coating thickness with respect to laboratory simulated EMI condition, using radio frequency from 10MHz to 5.8 GHz. Different metal namely pure nickel, nickel-phosphorous and pure plated copper are studied for their effectiveness of EMI sheilding. Our first result showed over 35-40dB of shielding effectiveness is achievable on high frequency 868-5800MHz. Nevertheless on low frequency of 10MHz, the shielding effectiveness achievement is below than 25dB. To overcome the shielding need for lower frequency, we further expanded our test by choosing ferromagentic material Nicke/Ironl-alloy in combination with thick copper plating. With this new metal combination, EMI shielding effectiveness for lower frequency is improved to 40dB.