Self-thickening, cross-slip deformation twinning model

56Citations
Citations of this article
50Readers
Mendeley users who have this article in their library.
Get full text

Abstract

We propose a cross-slip deformation twinning model based upon our experimental in situ deformation of Cu-Ge alloys using a transmission electron microscope. During the deformation, Shockley partials are emitted from the grain boundaries, which encounter an obstacle within the grain and split to nucleate deformation twins in the cross slip as well as primary planes. Upon further deformation a thickening process for twins is directly observed. The proposed model provides a dislocation mechanism for the observed simultaneous twin thickening in both the cross-slip and primary planes. The role of the proposed mechanism in the deformation of nanocrystalline materials is discussed. © 2008 American Institute of Physics.

Cite

CITATION STYLE

APA

Narayan, J., & Zhu, Y. T. (2008). Self-thickening, cross-slip deformation twinning model. Applied Physics Letters, 92(15). https://doi.org/10.1063/1.2911735

Register to see more suggestions

Mendeley helps you to discover research relevant for your work.

Already have an account?

Save time finding and organizing research with Mendeley

Sign up for free