Underpotential deposition of copper on electrochemically treated polycrystalline Au surfaces

Abstract

Cyclic voltammetric responses of electrochemically treated polycrystalline gold surfaces have been examined using Cu-UPD probe reactions (UPD-underpotential deposition). The treatment procedure used appears to induce preferential crystal orientation of the Au surface with a very small roughness factor and affords a simple method to obtain well-defined surfaces for electrochemical studies. © 1991 Indian Academy of Sciences.