Influence of Adding Silicon Dioxide in Particleboard from Teak Sawdust to Reduce Water Absorption and Thickness Swelling

Abstract

This study investigated the influence of silicon dioxide (SiO2) addition to particleboard from teak sawdust to reduce water absorption and thickness swelling using standard tests of physical and mechanical properties. The experiment had a completely randomized design with four treatments (SiO2 concentrations of 5%, 3%, 1%, and 0%), each with three replicates, for a total of 12 conditions. The results showed that 1% concentration was the optimal concentration to reduce both water absorption (32.42% ± 1.78%) and thickness swelling (8.65% ± 1.16%). The product passed the standard tests for physical and mechanical properties, which reduced the cost of the SiO2 content for particleboard processing. These results suggest that SiO2 can resist moisture content but may slightly reduce strength.