Crosstalk in Interconnects of Multilayer Printed Circuit Boards in the Form of Twisted Pairs

Abstract

Multilayer printed circuit boards are widely used in the development of modern electronic devices. But for their effective use it is often necessary to solve problems of electromagnetic compatibility. The application of interconnections of multilayer printed circuit boards in the form of twisted pairs is considered. Structurally, a twisted pair is implemented in two layers of a multilayer printed circuit board using vias. The paper analyzes electromagnetic crosstalk in the interconnections of multilayer printed circuit boards in the form of twisted pairs. The results are compared with the results of crosstalk analysis in coplanar interconnects. The results of the comparison show that the use of twisted pair leads to a reduction in crosstalk at the far end of the communication line.